OPTOELECTRONIC INDUSTRY

Inspection Products

LED and other optoelectronics products and more…

Inspection Capabilities

Top Surface

Chipped package, No Marking alignment, Incomplete mark, Double mark, Contamination, Bubble, No Resin, Excess resin(Overfill), Mix device, Mixed colour, Limited Die & Wirebond Detection.

Bottom Surface

Lead related defects, Package Chipping, Damage, Resin Overflows, Contamination.

Side Surface

Lead related defects, Package chipping, Damage, Contamination.